Substrates 150mm and 200mm (adding 300mm in 2021)
Squares or rounds
Silicon, Borosilicate, Ceramic, Sapphire, MEMs, LEDs
Cleaning and Inspection
Alignment Layer Deposition
Cassette to cassette transfer
Contact or non-contact substrate mounting
HANA offers low and high volume wafer processing. Our advanced production technologies streamline IC manufacturing processes resulting in reliable performance, maximum protection, and quick turnaround wafer packaging.