WAFER PROCESSING 

Wafer processing

WAFER-LEVEL PACKAGING

Substrates 150mm and 200mm (adding 300mm in 2021)

  • Squares or rounds

  • Silicon, Borosilicate, Ceramic, Sapphire, MEMs, LEDs

 

Cleaning and Inspection

 

Alignment Layer Deposition

  • Organic alignment

  • Inorganic alignment

 

Rubbing

  • Auto alignment

  • Cassette to cassette transfer

Wafer Assembly

 

Laser Marking

 

Dicing Process

  • Contact or non-contact substrate mounting

  • Cleaning

HANA offers low and high volume wafer processing. Our advanced production technologies streamline IC manufacturing processes resulting in reliable performance, maximum protection, and quick turnaround wafer packaging.